Amper

Exhibitors list

Nomenclature

7. Electronic Components and Modules

• 7.1. Semiconductor Components and Circuits
  • 7.1.1. Power Semiconductor Components and Modules
  • 7.1.2. Microprocessor Technology (Integrated Circuits ASIC/CSICS, Programmable Logic Circuits, DSP, Microcontrollers)
  • 7.1.3. Memories, HDD

  • 7.1.4. A/D and D/A Converters
  • 7.1.5. Semiconductor Components for Microwave Technology
  • 7.1.6. Analogue Circuits
• 7.2. Optical, Photonic Components, and Modules
  • 7.2.1. Optical, Photonic Components, and Modules

  • 7.2.2. Imaging
• 7.3. Passive Components
  • 7.3.1. Resistors and Capacitors
  • 7.3.2. Coils, Reactors and Transformers
  • 7.3.3. Potentiometers for Electronics
  • 7.3.4. Magnetic Material and Products

  • 7.3.5. Electro Ceramic Products
  • 7.3.6. RF and Microwave Parts
  • 7.3.7. Other Passive Components
• 7.4. Electromechanical Components
  • 7.4.1. Electromagnetic Components, Equipment, Valves, and Electromagnets

  • 7.4.2. Relays and Relay Elements
• 7.5. Mechanical, Interconnecting, and Other Components for Electronics
  • 7.5.1. Switches, Keyboards, Other Components
  • 7.5.2. Connectors, Terminal Blocks, Sockets, Cables
  • 7.5.3. Small Motors and Fans
  • 7.5.4. Electro-Acoustic Transducers

  • 7.5.5. Power Supply for Electronics
  • 7.5.6. Cases, Housings for Electronics, and Its Accessories
  • 7.5.7. Coolers and Heat Distribution
• 7.6. Displays and Monitors
  • 7.6.1. LCD Technologies
  • 7.6.2. Plasma Technologies
  • 7.6.3. LED Technologies
  • 7.6.4. OLED Technologies

  • 7.6.5. Other Technologies
  • 7.6.6. Touch Panels
  • 7.6.7. Peripheral Equipment for Displays
• 7.7. Printed Circuit Boards - PCB´S and Mounting Accessories
  • 7.7.1. One or Double Sided PCB´S
  • 7.7.2. Multiplied PCB´S
  • 7.7.3. Ceramic PCB´S
  • 7.7.4. Flexible PCB´S

  • 7.7.5. Bus PCB´S
  • 7.7.6. Accessories for PCB´S
  • 7.7.7. Software for PCB´S Designing
• 7.8. Organic and Printed Electronic
• 7.9. Software for Development
• 7.10. SMD Technologies
• 7.11. Assemblies and Subsystems
• 7.12. Embedded Systems, Micro and Nano Systems
• 7.13. CAD, CAM, CIM for Electronic Components, and Modules
• 7.14. Materials, Technologies, Electrochemistry
• 7.15. Electronics Cleaning
• 7.16. Other Electronic Components and Modules

ALL | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | #

restrictions of alphabet for the chosen field / fields

Country: Albania Algeria Argentina Armenia Austria Belarus Belgium Bosnia and Herzegovina Brazil Bulgaria Canada Croatia (Hrvatska) Cyprus Czech Republic Denmark Egypt Estonia Finland France Georgia Germany Greece Hong Kong Hungary China India Indonesia Iran (Islamic Republic of) Iraq Ireland Israel Italy Japan Kazakhstan Korea, Republic of Kyrgyzstan Latvia Libyan Arab Jamahiriya Liechtenstein Lithuania Luxembourg Macedonia Malta Mexico Moldova, Republic of Monaco Mongolia Montenegro Morocco Netherlands New Zealand Norway Oman Pakistan Poland Portugal Romania Russian Federation San Marino Saudi Arabia Serbia Singapore Slovakia Slovenia Spain Sweden Switzerland Taiwan Turkey Turkmenistan Ukraine United Arab Emirates United Kingdom United States Uzbekistan Vatican City State Vietnam

Exhibitor		info *		stand
	Kovohutě Příbram nástupnická, a.s.		Traditional producer of soft solders: lead free solders, solders in...	F 2.27
	TELUX, spol. s r.o.			F 4.12
	ULBRICH HYDROAUTOMATIK s.r.o.		Materials, chemical products and...	F 4.03
	VOGT AG Verbindungstechnik		Electrical & connection technique - riveting technique,...	F 3.09
	Weidmüller, s.r.o.			P 4.15

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